Display panel and a light source used therein

ABSTRACT

A display panel and a light source device used therein are provided. The display panel includes a light-guide thin-film circuit substrate, a light source and a polarizing layer. The light-guide thin-film circuit substrate has a light entrance end and a light exit top surface, and the light source is disposed corresponding to the light entrance end. The polarizing layer is disposed on the light-guide thin-film circuit substrate and parallels the light exit top surface of the light-guide thin-film circuit substrate. The light produced by the light source enters the circuit substrate through the light entrance end, guided and transmitted through the circuit substrate, and then leaves the circuit substrate through the light exit top surface and enters the polarizing layer. The light after passing through the polarizing layer is turned into a polarized light having flat light source effect as a backlight source for the system.

This application is a divisional application of U.S. application Ser.No. 12/701,680, filed on Feb. 8, 2010, now U.S. Pat. No. 8,096,696,which is a divisional application of U.S. Ser. No. 12/028, 978, filed onFeb. 11, 2008, now U.S. Pat. No. 8,092,067, which claimed the benefitfrom the priority of Taiwan Patent Application No. 096108999 filed onMay 15, 2007, the disclosures of which are incorporated by referenceherein in their entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to display panels and lightsource modules used therein, and more particularly to a liquid crystaldisplay (LCD) panel and a light source module used therein.

2. Description of the Prior Art

Various display panels and display panel devices have gradually becomethe mainstream of the display devices. For example, various displayscreens, household flat panel TVs, monitors of personal computers andlaptops, display screens of mobile phones and digital cameras aretypical products using the display panel extensively. The display panelsare currently divided into self-luminous display panels includingorganic light emitting diode (OLED) panels, and non self-luminousdisplay panels requiring external light sources, such as liquid crystaldisplay (LCD) panels.

Due to the volumes of various electronic devices using display panelskeep reducing, the thickness of the display panel has to be reduced aswell. FIG. 1 shows a schematic view of a conventional LCD panel. Asshown in FIG. 1, the display panel includes a light guide plate 10, areflector 15, optical films 20, a light source 30, a lower substrate 40and an upper substrate 50. The light source 30 is disposed on one end ofthe light guide plate 10, and the reflector 15 is disposed under thelight guide plate 10. The light produced by the light source 30 entersthe light guide plate 10 through the end of the light guide plate 10,and is distributed on the light guide plate 10 through the reflection ofthe light guide plate 10 and the reflector 15. The optical films 20including a diffusion sheet, a brightness enhancing film, a polarizer orother types of optical films are disposed above the light guide plate10. After the light produced by the light source 30 leaves the lightguide plate 10, it immediately passes through the optical films 20 forfurther optical treatment. The lower substrate 40 and the uppersubstrate 50 are disposed above the optical films 20, and a liquidcrystal layer is disposed in between. A thin film circuit is disposed onthe lower substrate 40 to control the liquid crystal molecules. Thelight passing through the optical films 20 goes into the lower substrate40, and generates images through the upper substrate 50 after passingthrough the liquid crystal layer.

In this conventional display panel, numerous processes through the lightguide plate 10 and the optical films 20 are required in order to produceuniform light output from the light source 30 and polarized properties.However, the light guide plate 10 and the optical films 20 occupy acertain percentage of the overall thickness of the display panel.Accordingly, how to reduce the overall thickness of the display panel byintegrating and minimizing the use of the light guide plate 10 and theoptical films 20 is an important issue.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide a display panelhaving a thinner thickness.

It is another object of the present invention to provide a display panelhaving fewer components.

It is a further object of the present invention to provide a displaypanel that requires less assembly labor hours and cost.

It is yet another object of the present invention to provide a lightsource module that reduces the overall thickness of the display panel.

It is still another object of the present invention to provide a lightsource module that provides polarized light depending on therequirements.

The display panel according to the present invention includes alight-guide thin-film circuit substrate, a reflector, a light source anda polarizing layer. The light-guide thin-film circuit substrate has alight entrance end and a light exit top surface, and the light entranceend is at one end of the light exit top surface. The light source isdisposed corresponding to the light entrance end of the light-guidethin-film circuit substrate. The light produced by the light sourceenters the light-guide thin-film circuit substrate through the lightentrance end, guided and transmitted through the light-guide thin-filmcircuit substrate, and then leaves the circuit substrate through thelight exit top surface. The reflector is disposed under the light-guidethin-film circuit substrate for reflecting the light leaking out of thebottom surface of the circuit substrate to enhance the light utilizationefficiency,

The polarizing layer is disposed on the light-guide thin-film circuitsubstrate and parallels the light exit top surface of the light-guidethin-film circuit substrate. The relative position between thepolarizing layer and the light-guide thin-film circuit substrate may bechanged depending on the requirement. For example, the polarizing layermay cover the light exit top surface of the circuit substrate and existsin the form of a polarizing film. However, the polarizing layer may bedisposed within the light-guide thin-film circuit substrate, or thewhole circuit substrate may be employed as the polarizing layer. Afterthe light is shot from the light exit top surface of the circuitsubstrate, a polarized light having flat light source effect is formedafter passing through the polarizing layer and is employed as abacklight source for the system.

The display panel may further include a plurality of light deviatingstructures. The light deviating structures are contained at thelight-guide thin-film circuit substrate and distributed along adirection parallel to the light exit top surface. The light-guidethin-film circuit substrate guides the light of the light source throughthe internal reflection to distribute over the light exit top surface,and the light deviating structures cause the light within the circuitsubstrate to deviate, therefore the internal reflection is furtheraffected and the light output from the light exit top surface is moreuniform.

In another embodiment, the display panel includes a light guidesubstrate, a circuit, a plurality of coupling portions and a lightsource. The light guide substrate has a light entrance end and a topsurface, and the light entrance end is at one end of the top surface.The circuit is formed on the top surface of the light guide substrate.The plurality of coupling portions is disposed on an end surface of thelight entrance end. The coupling portions extend to the top surface ofthe light guide substrate to electrically connect with the circuit. Thelight source includes a paired pins and a light emitting unit. Thepaired pins are electrically coupled to the coupling portionsrespectively, and the light emitting unit is disposed between the pairedpins and electrically coupled to the paired pins. The light emittingunit has a light emitting surface facing the light entrance end of thelight guide substrate. The light produced by the light emitting unitenters the light entrance end through the light emitting surface, and isguided and distributed over the top surface of the light guide substratethrough the light guide substrate.

The light emitting unit may further include a main body and anelectroluminescence unit. The main body is disposed between the pairedpins and forms an inner space and a light exit. The electroluminescenceunit is contained within the inner space of the main body, and the twoelectrodes are electrically coupled to the paired pins respectively. Oneside having the light exit of the main body forms an overall lightemitting surface, and the polarizer is disposed on the main body andcovers the light exit. When the electroluminescence unit produces light,the light is shot from the light exit and turned into a polarized lightafter passing through the polarizer, and then leaves the light source.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view of a conventional display panel.

FIG. 2 a is a cross-sectional schematic view of the display panel inaccordance with one embodiment of the present invention.

FIG. 2 b-FIG. 2 d are cross-sectional schematic views of the lightsource arrangement of the display panel in accordance with anotherembodiment of the present invention.

FIG. 3 is a cross-sectional schematic view of the display panelincluding the diffusion layer in accordance with one embodiment of thepresent invention.

FIG. 4 is a cross-sectional schematic view of the display panelincluding the polarizer in accordance with one embodiment of the presentinvention

FIG. 5 a is a cross-sectional schematic view of the display panelincluding the light deviating structures in accordance with oneembodiment of the present invention.

FIG. 5 b is a schematic view of the display panel including the lightdeviating structures in accordance with another embodiment of thepresent invention.

FIG. 6 a-FIG. 6 b are schematic views of the display panel including thelight deviating structures in accordance with another embodiment of thepresent invention.

FIG. 7 a-FIG. 7 b are schematic views of the display panel including thelight deviating structures in accordance with another embodiment of thepresent invention.

FIG. 8 a is a cross-sectional schematic view of the display panel inaccordance with another embodiment of the present invention.

FIG. 8 b is a top view of the embodiment shown in FIG. 8 a.

FIG. 9 is a top view of the light guide substrate before been cut from abase substrate in one embodiment.

FIG. 10 is a cross-sectional view of the display panel in anotherembodiment.

FIG. 11 is a schematic view of the light source device in oneembodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The present invention provides a display panel and a light source moduleused therein. In a preferred embodiment, the display panel according tothe present invention includes a liquid crystal display (LCD) panel. TheLCD devices refer generally to the display devices using LCD panels,including LC monitors of household LCTVs, personal computers andlaptops, and LC display screens of the mobile phones and digitalcameras.

As shown in FIG. 2 a, the display panel in accordance with the presentinvention includes a light-guide thin-film circuit substrate 200, areflector 150, a light source 300 and a polarizing layer 400. Thelight-guide thin-film circuit substrate 200 has a light entrance end 210and a light exit top surface 230, and the light entrance end 210 is atone end of the light exit top surface 230. In the preferred embodiment,the light-guide thin-film circuit substrate 200 also includes athin-film circuit layer 250. The light-guide thin-film circuit substrate200 is made of transparent or semi-transparent materials; in thepreferred embodiment, the light-guide thin-film circuit substrate 200 ismade of organic resin materials, glass, quartz, or other transparent orsemi-transparent materials.

The light source 300 is disposed corresponding to the light entrance end210 of the light-guide thin-film circuit substrate 200. Light from thelight source 300 enters the circuit substrate 200 through the lightentrance end 210, guided and transmitted through the circuit substrate200, then leaves the circuit substrate 200 through the light exit topsurface 230. The light source 300 preferably includes light emittingdiodes (LEDs); however, in other embodiments, the light source 300 mayinclude a linear light source and other forms of light source. Thereflector 150 is disposed under the circuit substrate 200 for reflectingthe light leaking out of the bottom surface of the circuit substrate 200to enhance the light utilization efficiency. The reflector 150 ispreferably made of acrylonitrile butadiene styrene (ABS) copolymers,polycarbonate (PC), or any materials that reflect light; however, inother embodiments, the reflector 150 may be formed on the bottom surfaceof the circuit substrate 200 directly by electroplating, sputtering, andthe like.

In the embodiment shown in FIG. 2 a, the display panel further includesan upper substrate 110. The upper substrate 110 is above the light-guidethin-film circuit substrate 200 and overhangs the light entrance end210. A liquid crystal (LC) layer 130 is disposed between the uppersubstrate 110 and the circuit substrate 200. The bottom surface of theupper substrate 110 corresponds to the light exit top surface 230 of thecircuit substrate 200. The light source 300 is disposed on the bottomsurface of the upper substrate 110, and is located on the outside of thelight entrance end 210 of the circuit substrate 200. The light source300 is disposed facing the light entrance end 210, and therefore thelight emitting out of the light source 300 can transmit directly intothe light entrance end 210.

However, in the embodiment shown in FIG. 2 b, the light source 300 isdirectly connected to the light-guide thin-film circuit substrate 200close to the end surface of light entrance end 210. The light source 300emits light toward the light entrance end 210, and consequently thelight produced by the light source 300 can go directly into the lightentrance end 210. FIG. 2 c shows another embodiment. In this embodiment,the light source 300 is engaged firmly with the light exit top surface230 of the circuit substrate 200 close to the light entrance end 210.The light exit surface of the light source 300 faces the light exit topsurface 230 and thereby the light produced by the light source 300enters the circuit substrate 200 through the light exit top surface 230.The light entering the circuit substrate 200 can be distributedthroughout the circuit substrate 200 by the reflection effect of thecircuit substrate 200 and the reflector 150.

The polarizing layer 400 is disposed on the light-guide thin-filmcircuit substrate 200 and parallels the light exit top surface 230 ofthe circuit substrate 200. The above parallel distribution does notlimit that the polarizing layer 400 shall distribute on the surface orthe interior of the circuit substrate 200. The relative position betweenthe polarizing layer 400 and the circuit substrate 200 can be changed tosatisfy various design demands. In the embodiment as shown in FIG. 2 a,the polarizing layer 400 covers the light exit top surface 230 of thecircuit substrate 200 and exists in the form of a polarizing film.However, in the embodiment shown in FIG. 2 b, the polarizing layer 400is disposed within the circuit substrate 200 and forms an intermediatelayer. In other embodiments, the circuit substrate 200 may be employedas the polarizing layer 400. This arrangement also accords with therequirement of the polarizing layer 400 parallel to the light exit topsurface 230. Moreover, the polarizing layer 400 is preferably disposedon the thin film circuit layer 250; however, in other embodiments, thepolarizing layer 400 may be disposed under the thin film circuit layer250.

As shown in FIG. 2 d, the display panel further includes a lowrefractive layer 450. The low refractive layer 450 is disposed under thethin film circuit layer 250 of the light exit top surface 230, and thepolarizing layer 400 is disposed on the low refractive layer 450.However, in other embodiments, the polarizing layer 400 may be disposedabove the thin film circuit layer 250. The refractive index (RI) of thelow refractive layer 450 is smaller than that of the light-guidethin-film circuit substrate 200. The light reflection and transmissionefficiency within the circuit substrate 200 is enhanced throughdisposing the low refractive layer 450 to guide a partial light into theback end of the circuit substrate 200. In the preferred embodiment, thelow refractive layer 450 is an air layer within the circuit substrate200. The air layer can be formed by laser, or other package or adhesionmethods, etc. However, in other embodiments, the low refractive layer450 may be formed on the circuit substrate 200 by film coating. Inaddition, in the embodiment shown in FIG. 2 b, when the refractive indexof the polarizing layer 400 is smaller than that of the circuitsubstrate 200 and the polarizing layer 400 is disposed directly underthe thin film circuit layer 250, the polarizing layer 400 can replacethe low refractive layer 450.

As shown in FIG. 2 a, the light-guide thin-film circuit substrate 200receives the light produced by the light source 300. Next, the light isguided to distribute on the light exit top surface 230 through theoptical reflection and refraction produced within the circuit substrate200 and by the reflector 150 to generate flat light source effect. Thelight enters the polarizing layer 400 right after emitting out of thelight exit top surface 230. The light emitting out of the polarizinglayer 400 is turned into a polarized light having the flat light sourceeffect. However, in the embodiment shown in FIG. 2 b, the light enteringthe circuit substrate 200 first passes through the polarizing layer 400for polarizing treatment, and then emits from the light exit top surface230.

In the embodiment shown in FIG. 3, the display panel according to thepresent invention further includes a diffusion layer 500. The diffusionlayer 500 is preferably distributed on or within the light-guidethin-film circuit substrate 200 by paralleling the light exit topsurface 230. The diffusion layer 500 is disposed on the side facing thecircuit substrate 200 of the polarizing layer 400; in other words, whenthe circuit substrate 200 placed horizontally is viewed, as shown inFIG. 3, the diffusion layer 500 is disposed under the polarizing layer400. The primary purpose of the diffusion layer 500 is to scatter thepassing light to achieve more uniform light output. In this embodiment,the light within the circuit substrate 200 first passes through thediffusion layer 500 to create more scattering light, and only then thelight enters the polarizing layer 400 to be polarized.

As shown in FIG. 3, the diffusion layer 500 preferably covers thethin-film circuit layer 250. However, in other embodiments, thediffusion layer 500 may be disposed under the thin film circuit layer250. When the diffusion layer 500 is disposed under the thin filmcircuit layer 250 and the refractive index is smaller than that of thelight-guide thin-film circuit substrate 200, it can replace the lowrefractive layer 450 (as shown in FIG. 2 d). Furthermore, in thisembodiment, the diffusion layer 500 is formed on the circuit substrate200 in the form of a thin film and includes a plurality of diffusionparticles 510 within. The diffusion particles 510 are preferablypermeated into the diffusion layer 500 or the raw materials before orduring the thin film process. In the preferred embodiment, the diffusionparticles 510 include methyl methacrylate (MMA), silicon dioxide (SiO₂),titanium dioxide (TiO₂), and the like. However, in other embodiments,the diffusion layer 500 may achieve the light diffusion effect throughdisposing light diffusion microstructures on the surface.

In the embodiment shown in FIG. 4, the display panel further includes apolarizer 600. The polarizer 600 is disposed between the light source300 and the light entrance end 210 of the light-guide thin-film circuitsubstrate 200. The polarizer 600 preferably includes a polarizing filmadhered to the light source 300 or to the light entrance end 210. Itshall be noted that the above mentioned light entrance end 210 does notrefer only to one end surface of the circuit substrate 200, but refersgenerally to the neighboring region of the end on the circuit substrate200 receiving the light from the light source 300. For instance, theportion of the light exit top surface 230 close to the end surface ofthe circuit substrate 200 is also included within the boundary of thelight entrance end 210.

In the embodiment shown in FIG. 4, two lateral sides of the polarizer600 are connected closely to the light source 300 and to the end surfaceof the light entrance end 210 of the light-guide thin-film circuitsubstrate 200 respectively to reduce the impact of the intervening airlayer on the light paths. As shown in FIG. 4, the light produced by thelight source 300 first passes through the polarizer 600 and then entersthe light entrance end 210 of the circuit substrate 200; in other words,the light entering the light entrance end 210 of the circuit substrate200 is the polarized light.

FIG. 5 a shows another embodiment of the present invention. In thisembodiment, the display panel includes the light-guide thin-film circuitsubstrate 200, the reflector 150, the light source 300 and a pluralityof light deviating structures 700. In this embodiment, the circuitsubstrate 200, the reflector 150 and the light source 300 are disposedin a way similar to the previous embodiment. The light deviatingstructures 700 are included at the circuit substrate 200 and distributedalong a direction parallel to the light exit top surface 230; in otherwords, the light deviating structures 700 are disposed on or within thecircuit substrate 200. As shown in FIG. 5 a, the circuit substrate 200guides the light produced by the light source 300 through the internalreflection to distribute on the light exit top surface 230, and thelight deviating structures 700 cause the light within the circuitsubstrate 200 to deviate, therefore the internal reflection is furtheraffected and the light output from the light exit top surface 230 ismore uniform.

In the embodiment shown in FIG. 5 a, the light deviating structures 700are formed within the light-guide thin-film circuit substrate 200. Inthis embodiment, the light deviating structures 700 include bubblesformed within the circuit substrate 200. The bubbles are preferablyformed within certain spots of the circuit substrate 200 by laserinjection. However, in other embodiments, other physical or chemicalmethods may be employed to produce the bubbles as the light deviatingstructures 700. Moreover, in still other embodiments, the lightdeviating structures 700 may be formed through implanting particles,alloys, etc. As shown in FIG. 5 a, the light produced by the lightsource 300 enters the circuit substrate 200 through the light entranceend 210. A partial light reaches to the far end of the circuit substrate200 through the total internal reflection and the reflection of thereflector 150, and other partial light deviates through the lightdeviating structures 700 to transmit directly to the light exit topsurface 230, or forms the emitting light through another reflection.Excessive total internal reflection (TIR) within the circuit substrate200 can be prevented through disposing the light deviating structures700 and thereby produce the uniform light distribution on the light exittop surface 230.

In the embodiment shown in FIG. 5 b, the light deviating structures 700are formed on the bottom surface of the light-guide thin-film circuitsubstrate 200. The light deviating structures 700 in this embodimentincludes protrusions formed on the bottom surface of the circuitsubstrate 200, and the side facing the circuit substrate 200 of thoseprotrusions have a plurality of inclined planes sloped towards the lightentrance end 210. The protrusions can be formed on the bottom surface ofthe circuit substrate 200 by printing, rolling, etching ormicromechanical cur machining.

As shown in FIG. 5 b, the light entering the light-guide thin-filmcircuit substrate 200 is transmitted to other areas of the circuitsubstrate 200 partially through the total reflection, and the partiallight through the reflection of the light deviating structures 700changes its original total reflection path, and then emits to theoutside of the circuit substrate 200 through the light exit top surface230. Moreover, in other embodiments, the light deviating structures 700formed on the circuit substrate 200 do not limit to the serratedprotrusions in this embodiment, but may be other-shaped structures, suchas hemispherical protrusions or waved protrusions, or may be formed byadding or by changing partial materials on the bottom surface.

As shown in FIG. 6 a and FIG. 6 b, the light deviating structures 700spread within the light-guide thin-film circuit substrate 200 or on thebottom surface have a variable distribution density. In the embodimentshown in FIG. 6 a and FIG. 6 b, the light deviating structures 700 closeto the light source 300 have a smaller distribution density; in otherwords, the portion of the circuit substrate 200 further away from thelight source 300 has a greater distribution density of the lightdeviating structures 700. Through the varied distribution density ofthese light deviating structures 700, excessive light on the portion ofthe circuit substrate 200 close to the light source 300 can be preventedfrom reflecting to the light exit top surface 230 to adjust the lightdistribution on the light exit top surface 230.

As shown in FIG. 7 a and FIG. 7 b, the light deviating structures 700spread within the light-guide thin-film circuit substrate 200 or on thebottom surface have a variable cross-section dimension. In theseembodiments, the light deviating structures 700 close to the lightsource 300 have smaller cross-section dimensions; in other words, thelight deviating structures 700 distributed on the portion of the circuitsubstrate 200 further away from the light source 300 have greater sizesof cross sections. Through the varied cross-section dimensions of theselight deviating structures 700, excessive light on the portion of thecircuit substrate 200 close to the light source 300 can be preventedfrom reflecting to the light exit top surface 230 to uniform the lightdistribution on the light exit top surface 230. The macroscopic view ofthe embodiments shown in FIG. 6 a, FIG. 6 b, FIG. 7 a and FIG. 7 billustrates the light distribution on the light exit top surface 230 canbe adjusted and uniformed by varying the occupied area percentage of thelight deviating structures 700 on the cross section or on the bottomsurface of the circuit substrate 200.

FIG. 8 a shows another embodiment of the present invention. In thisembodiment, the display panel includes a light guide substrate 810, acircuit 830, a plurality of coupling portions 850 and a light source870. The light guide substrate 810 has a light entrance end 811 and atop surface 813, and the light entrance end 811 is on the end portion ofthe top surface 813. The light guide substrate 810 is made oftransparent or semitransparent materials; in the preferred embodiment,the light guide substrate 810 can be made of organic resin materials,glass, quartz, or other transparent or semitransparent materials.

As shown in FIG. 8 a, the circuit 830 is formed on the top surface 813of the light guide substrate 810. In the preferred embodiment, thecircuit 830 is a thin-film circuit layer covering the top surface 813.

A plurality of coupling portions 850 is disposed on the end surface ofthe light entrance end 811 of the light guide substrate 810. Thecoupling portions 850 also extend to the top surface 813 of the lightguide substrate 810 to connect with the circuit 830. The couplingportions 850 are preferably made of conductive adhesive materials oforganic resins. The conductive adhesive materials are preferably themixture of the adhesive materials and conductive materials, and theconductive materials have to be dispersed evenly within the adhesivematerials. Common adhesive materials include thermosetting orphoto-curing adhesives. Common thermosetting adhesives includepolyesters, epoxy, silicone, urethanes, etc. Such high molecularmaterials facilitate the condensation and crosslinking reactions whenheat, pressure or a catalyst is applied to produce 3-dimensionalreticulate-structure polymers having good corrosion resistant andhumidity resistant properties, and suitable mechanical strength andreliability as well. The photo-curing high molecular portions can beacrylate, such as urethane diacrylate and epoxy diacrylate, and thephoto initiator includes benzophenone. The conductive materials includesilver, carbon, or other conductive materials wholly mixable withadhesive materials.

As shown in FIG. 8 b and FIG. 9 illustrating the top view of the displaypanel, a plurality of grooves 815 are formed on the end surface of thelight entrance end 811 of the light guide substrate 810. In thepreferred embodiment, as shown in FIG. 9, hole drilling can be performedon the light entrance end 811 of the top surface 813 before the lightguide substrate 810 is cut from a base substrate 801. Next, the grooves815 are formed on the end surface of the light entrance end 811 aftercutting the light guide substrate 810 from the base substrate 801, andthe cutting line has to pass through all the grooves 815 while cutting.

As shown in FIG. 8 b, one end of each groove 815 is exposed to the topsurface 813 of the light guide substrate 810, and a portion or the wholepart of each coupling portion 850 is disposed respectively withindifferent grooves 815. In the preferred embodiment, as shown in FIG. 9,materials, such as conductive adhesive materials of organic resins,forming the coupling portions 850 can be injected into the holes on thelight entrance end 811 before cutting the light guide substrate 810 fromthe base substrate 801. While cutting the light guide substrate 810, thecoupling portions 850 partially or wholly contained within the grooves815 are cut as well.

In the embodiment shown in FIG. 8 a, the display panel further includesa protective film 890. The protective film 890 covers the spot where thecoupling portions 850 connect with the circuit 830. The protective film890 may be formed by applying adhesives, film coatings or other suitablemethods on the spot where the coupling portions 850 connect with thecircuit 830. In addition, the material of the protective film 890includes insulating or conductive materials. The coupling portions 850are prevented from poor connection with or disengaging from the circuit830 through disposing the protective film 890.

Next, refers to FIG. 8 b, the light source 870 includes a paired pins871 and a light emitting unit 873. The paired pins are electricallycoupled to the coupling portions 850 respectively, and the connectionmethods include welding, adhesion and other non-conduction-hinderingmethods. The light emitting unit 873 is disposed between the paired pins871 and is electrically coupled to the paired pins 871. The lightemitting unit 873 is preferably a light emitting diode (LED); however,in other embodiments, the light emitting unit 873 may be other pointlight source or a linear light source. As shown in FIG. 8 b, the lightemitting unit 873 has a light emitting surface 875 facing the lightentrance end 811 of the light guide substrate 810. The light produced bythe light emitting unit 873 enters the light entrance end 811 throughthe light emitting surface 875 and is distributed on the top surface 813of the light guide substrate 810 through the light guide substrate 810.

As shown in FIG. 8 a and FIG. 8 b, the paired pins 871 preferablyinclude a L-shaped conductive structure including a power supplyconnecting surface 910 and a light-emitting-unit-connecting surfaceperpendicular to each other. The power supply connecting surface 910 iselectrically coupled to the circuit 830 providing signals, and thelight-emitting-unit-connecting surface 930 is electrically coupled tothe light emitting unit 873. In this embodiment, the power supplyconnecting surface 910 and the light emitting surface 875 of the lightemitting unit 873 both face the same direction. In other words, thepower supply connecting surface 910 faces the end surface of the lightentrance end 811 of the light guide substrate 810 and is electricallycoupled to the coupling portions 850. The light emitting surface 875 ofthe light emitting unit 873 also faces the end surface of the lightentrance end 811 and emits light toward the light entrance end 811.However, in another embodiment, as shown in FIG. 10, the power supplyconnecting surface 910 may be perpendicular to the light emittingsurface 875. In this embodiment, the paired pins 871 are not directlyconnected to the light guide substrate 810, but are connected to a lightsource substrate 950. The power supply method for the light emittingunit is, as the conventional method, by providing the light emittingunit 873 the power supply through the light source substrate 950.

In the embodiment shown in FIG. 11, the light source 870 includes apolarizer 970 disposed on the light emitting surface 875. The polarizer970 is preferably a polarized film formed by a plurality of filmcoatings. The light produced by the light emitting unit 873 enters thepolarizer 970 after leaving the light emitting surface 875. When thelight emits outward through the polarizer 970, the light is turned intoa polarized light. As shown in FIG. 11, the light emitting unit 873includes a main body 880 and an electroluminescence unit 980. The mainbody 880 is disposed corresponding to the paired pins 871, and an innerspace 885 and a light exit 887 are enclosed by side walls and a bottomsurface 883. The side walls 881 preferably include a reflective innersurface and predetermined reflective angle. Fluorescent powders or otherchemical materials are preferably sprayed on the inner space 885.

As shown in FIG. 11, the electroluminescence unit 980 is containedwithin the inner space 885 of the main body 880, and the two electrodesthereof are electrically coupled to the paired pins either directly orthrough the wires. The electroluminescence unit 980 is preferably alight emitting diode transistor. The side having the light exit 887 ofthe main body 880 forms the overall light emitting surface 875, and thepolarizer 970 is disposed on the main body 880 and covers the light exit887. When the electroluminescence unit 980 produces light, the lightemits outward from the light exit 887 and forms polarized light afterpassing through the polarizer 970, and then leaves the light source 870.However, in other embodiments, the main body 880 may be an optical lensmade of light-pervious materials and envelops the electroluminescenceunit 980 by forming as an integral part. In other words, theelectroluminescence unit 980 is embedded in the main body 880. Since themain body 880 has both packaging and optical lens effect, the light hasto first pass through the main body 880 before emitting outward. Thelight exit 887 at this point does not limit to the space enclosed by themain body 880 in FIG. 11, but includes the portion of the main body 880allowing the light to emit outward.

From the foregoing, it shall be appreciated that specific embodiments ofthe invention have been described herein for purposes of illustration,but that various modifications and alterations may be made by thoseskilled in the art without deviating from the spirit and scope of theinvention. For example, it shall be understood that there is nointention to limit the light deviating structures 700 to the specificforms disclosed, but on the contrary, the invention is to cover allmodifications, alternate constructions and equivalents falling withinthe spirit and scope of the invention. Accordingly, the invention is notlimited except as by the appended claims.

What is claimed is:
 1. A light source device comprising: a paired pins;a light emitting unit disposed between the paired pins and coupled tothe paired pin; wherein the light emitting unit has a light emittingsurface, the light emitting unit includes: a main body forming an innerspace and having a light exit; and an electroluminescence unit containedwithin the inner space and electrically coupled to the paired pinsrespectively; and a polarizer disposed on the light emitting surface ofthe light emitting unit; wherein one side of the main body having thelight exit forms the light emitting surface, the polarizer is disposedon the main body and covers the light exit, so that light from the lightemitting unit passes through the light emitting surface and thepolarizer in sequence and rays outward.
 2. The light source device ofclaim 1, wherein the polarizing member includes multi-layer coatings,polarizing coatings or polyvinyl alcohol (PVA) films with added iodinemolecules.